Heatsink: extruded; grilled; BGA,FPGA; black; L: 27mm; W: 27mm4.62€/ gab.Cena ieskaitot PVN 21%
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Manufacturer: | BOYD CORP |
Type of heatsink: | extruded |
Heatsink shape: | grilled |
Application: | BGA |
Application: | FPGA |
Colour: | black |
Length: | 27mm |
Width: | 27mm |
Height: | 10mm |
Material: | aluminium |
Material finishing: | anodized |
Vienības svars: | 0.007 kg |
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Minimālais pasūtījums: | 1 |