Module: LTE; Down: 300Mbps; Up: 50Mbps; LGA; 37x39.5x2.8mm79.77€/ gab.Cena ieskaitot PVN 21%
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Manufacturer: | MEIG SMART TECHNOLOGY |
Case: | LGA |
Operating temperature: | -30...75°C |
Interface: | ADC |
Interface: | GPIO |
Interface: | I2C |
Interface: | PCIe |
Interface: | PCM |
Interface: | SDIO |
Interface: | SIM |
Interface: | SPI |
Interface: | UART |
Dimensions: | 37x39.5x2.8mm |
Type of communications module: | LTE |
Communictions protocol: | DHCP |
Communictions protocol: | IPv4 |
Communictions protocol: | IPv6 |
Communictions protocol: | QMI |
Communictions protocol: | RNDIS |
Communictions protocol: | TCP |
Communictions protocol: | UDP |
Transmission: | GNSS |
Transmission: | LTE CAT6 |
Transmission: | LTE-FDD |
Transmission: | LTE-TDD |
Transmission: | WCDMA |
Uplink ransfer rate: | 50Mbps |
Downlink transfer rate: | 300Mbps |
Vienības svars: | 0.009 kg |
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Minimālais pasūtījums: | 1 |