Module: IoT; M.2; 5G,LTE,LTE-FDD,LTE-TDD,Sub-6G; 30x52x2.3mm294.07€/ gab.Cena ieskaitot PVN 21%
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Manufacturer: | MEIG SMART TECHNOLOGY |
Case: | M.2 |
Operating temperature: | -40...85°C |
Interface: | E-SIM |
Interface: | GPIO |
Interface: | PCIe |
Interface: | PCM |
Interface: | SIM |
Interface: | UART |
Interface: | USB |
Dimensions: | 30x52x2.3mm |
Type of communications module: | IoT |
Communictions protocol: | ECM |
Communictions protocol: | NDIS |
Communictions protocol: | RNDIS |
Communictions protocol: | TCP |
Communictions protocol: | UDP |
Transmission: | 5G |
Transmission: | LTE |
Transmission: | LTE-FDD |
Transmission: | LTE-TDD |
Transmission: | Sub-6G |
Components: | Qualcomm X62 |
Vienības svars: | 0.013 kg |
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Minimālais pasūtījums: | 1 |
Ir pieejams: 74 2.23 € -+ |